Toray Semiconductor Adhesive (TSA) tape

Toray's Semiconductor Adhesive (TSA) tape series has excellent properties such as high peel strength, outstanding elasticity even at low temperatures, and high insulation reliability, which are required for semiconductor packages. The TSA series is suitable for stiffener and heat spreader attachments for chip production as well as die bonding for various advanced semiconductor packages.

Copper Clad Polyimide Film

Toray produces 3-layered films composed of polyimide film, high-performance adhesive and copper clad foil for flexible printed circuits. Together with the adhesive tape, polyimide film products are used in Tape Adhesive Bonding (TAB) systems to attach controller chips of Liquid Crystal Displays (LCD) to the panel.

Various combinations of polyimide film, adhesive and copper clad can be customized to meet customers’ requirement. Toray’s Copper Clad Films offer:

• High insulation and high flexibility that enables the application of high density and three dimensional wiring.
• High peal strength and excellent chemical resistance suitable for a variety of production processes.
• UL94 V-0 flame retardant.
  

< New Product >

1. Green CCL & CL

Toray has developed halogen free Copper Clad Laminate (CCL) and Coverlay Film (CL) with necessary basic properties like peel strength, solder resistance, and insulation resistance.

2. CCL with extra copper foil for fine pattern applications (1/3 oz, ¼ oz)

• Customers can choose polyimide film and copper-foil according to their application needs.
• Greater cost efficiency than adhesiveless 2 layers CCL